Wafer Equipment Engineer (Software)

Executive recruitment company Monroe Consulting Group's Industrial Division is exclusively partnered with multinational organization who is well established in the field of manufacturing.

Main Qualification(s):

  • Work experience in Thin Wire (under 40um), Thin Wafer (below 150um) development/production/processing
    • Over minimum 7 years of work experience required (engineers who started their careers before 2015)
    • Work experience in either (1) Production (2) Process development (3) Maintenance of DWS Equipment
    • Experience in writing SOP (Standard Operating Procedures)
  • Work experience in establishing wafer automation line within the China market is a plus
  • Work experience in establishing equipment for Diamond Wire Saw, Cleaning/Separation/Inspection process

Key job responsibilities include:

  • Improving DWS process (recipe development, enhancing slicing/cutting performance, reducing processing time, enhancing the yield, cost reduction)
  • Improving cleaning process (recipe development, improving wafer cleaning efficiency, reducing cleaning time, other cost-saving tasks, etc.)
  • Maintaining Wafer production equipment/facilities and logistics Automation Lines

[Executive/Senior Manager Level]

  • Managing/controlling & operating overall production process equipment/facilities in lines
  • Clarifying team members' R&R, establishing & managing team KPIs
  • Supervising Logistics automation & managing status of logistics
  • Planning equipment operation & approving plans related to equipment purchasing
  • Reviewing the rate of operation & any deficiencies, process improving
  • Investigating the cause of any loss from equipment failure, applying precautions treatment, assigning/employee allocation

[Manager Level]

  • Maintenance tasks of process/logistics automation & its development
  • Managing & improving process automation
  • Managing & improving AMR Control System
  • Developing & ImprovingequipmentPLC software
    • Managing equipment software for each process and PLC data backup
    • Analyzing & Improving PLC Logic

Preferred Skillset:

  • Skillset in 2D/3D CAD Design, PLC, AGV, AMR Operations
  • Knowledge for Mechanical / Electrical Engineering

Key Job requirements include:

  • Natural science/engineering majors (minimum bachelor degree)
  • Work experience in more than 20GW-scale Wafer manufacturing factories
  • Work experience in Wafer process development/production/equipment team
    • Over minimum 7 years of work experience required (engineers who started their careers before 2015)
    • Work experience in either (1) production (2) process development (3) maintenance of DWS Equipment
    • Experience in writing SOP (Standard Operating Procedures)
  • Work experience in DWS equipment manufacturer
  • Project experience in developing Thin Wire (less than 150um) M10,G12 size Wafer slicing process
    • Analyzing causes of Diamond Wire Breakage & problem-solving activities:
      • (1) Equipment aspect (2) Recipe aspect (3) Subsidiary materials aspect (Wire, Additive/Coolant, Wire Guide Roller, etc. (4) Other troubleshooting tasks
    • Experience in WINS algorithms & setting inspector recipe / Experience in operating AMAT, AUTOWELL equipment
    • Experience in DWS Spindle Overhaul as equipment engineers
    • Experience in operating wafer automation line (AGV, AMR)